Shao, Yi Ta: search on Z-Library

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1

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Yu-Wei Lin, Ren-You Wang, Wun-Bin Ke, I-Sheng Wang, Ying-Ta Chiu, Kuo-Chang Lu, Kwang-Lung Lin, Yi-Shao Lai

Journal:

Materials Science and Engineering: A

Year:

2012

Language:

english

File:

PDF, 1.49 MB

english, 2012

2

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.67 MB

english, 2012

3

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 637 KB

english, 2009

4

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints

Yao-Ren Liu,, Jenn-Ming Song,, Yi-Shao Lai,, Ying-Ta Chiu,

Year:

2009

Language:

english

File:

PDF, 1.35 MB

english, 2009

5

SPIE Proceedings [SPIE SPIE Photomask Technology - Monterey, California, United States (Tuesday 29 September 2015)] Photomask Technology 2015 - Quantitative analysis of CD degradation induced by the fogging effect in e-beam lithography

Hayashi, Naoya, Kasprowicz, Bryan S., Chang, Shao-Wen, Wang, Tzu-Yi, Lien, Ta-Cheng, Chen, Chia-Jen, Lin, Chih-Cheng, Lee, Sin-Chang, Yen, Anthony

Year:

2015

Language:

english

File:

PDF, 350 KB

english, 2015

6

Differentiation of visual spectra and nuptial colorations of twoParatanakia himantegussubspecies (Cyprinoidea: Acheilognathidae) in response to the distinct photic conditions of their habitats

Chang, Chia-Hao, Shao, Yi Ta, Fu, Wen-Chung, Anraku, Kazuhiko, Lin, Yeong-Shin, Yan, Hong Young

Journal:

Zoological Studies

Year:

2015

Language:

english

File:

PDF, 2.03 MB

english, 2015

7

Acupuncture reduced the medical expenditure in migraine patients

Tsai, Sheng-Ta, Tseng, Chun-Hung, Lin, Mei-Chen, Liao, Hsien-Yin, Teoh, Boon-Khai, San, Shao, Tsai, Chon-Haw, Huang, Hung-Yu, Lin, Yi-Wen

Journal:

Medicine (Williams & Wilkins)

Year:

2020

File:

PDF, 425 KB

2020

8

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 548 KB

english, 2008

9

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Chiu-Wen

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 880 KB

english, 2009

10

The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Lin, Yu-Wei, Ke, Wun-Bin, Wang, Ren-You, Wang, I-Sheng, Chiu, Ying-Ta, Lu, Kuo-Chang, Lin, Kwang-Lung, Lai, Yi-Shao

Journal:

Surface and Coatings Technology

Year:

2013

Language:

english

File:

PDF, 940 KB

english, 2013

11

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.78 MB

english, 2007

12

[IEEE 2009 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - Boston, MA, USA (2009.06.7-2009.06.9)] 2009 IEEE Radio Frequency Integrated Circuits Symposium - An RF transceiver with auto signal detection and combined PGA/RSSI in 0.18µm CMOS for V2.1 Bluetooth applications

Wei-Yi Hu,, Jia-Wei Lin,, Kuo-Chi Tien,, Yong-Hsiang Hsieh,, Chao-Liang Chen,, Hung-Ta Tso,, Yi-Shun Shih,, Shao-Chueh Hu,, Sao-Jie Chen,

Year:

2009

Language:

english

File:

PDF, 968 KB

english, 2009

13

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages

Kao, Chin-Li, Chen, Tei-Chen, Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.86 MB

english, 2014

14

Clinicopathological features of mismatch repair protein expression patterns in colorectal cancer

Lee, Chung-Ta, Chow, Nan-Haw, Chen, Yi-Lin, Ho, Chung-Liang, Yeh, Yu-Min, Lin, Shao-Chieh, Lin, Peng-Chan, Lin, Bo-Wen, Chu, Chien-An, Tsai, Hung-Wen, Lee, Jenq-Chang

Journal:

Pathology - Research and Practice

Year:

2020

File:

PDF, 268 KB

2020

15

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections

Liu, Yao-Ren, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, Chen, Wei-Ting

Year:

2008

Language:

english

File:

PDF, 2.60 MB

english, 2008

16

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, Wei-Chieh, Lin, Kwang-Lung, Chiu, Ying-Ta, Lai, Yi-Shao

Year:

2013

Language:

english

File:

PDF, 2.94 MB

english, 2013

17

Hormonal changes over the spawning cycle in the female three-spined stickleback, Gasterosteus aculeatus

Roufidou, Chrysoula, Schmitz, Monika, Mayer, Ian, Sebire, Marion, Katsiadaki, Ioanna, Ta Shao, Yi, Borg, Bertil

Journal:

General and Comparative Endocrinology

Year:

2017

Language:

english

File:

PDF, 823 KB

english, 2017

18

Largescale mullet (Planiliza macrolepis) can recover from thermal pollution-induced malformations

Shao, Yi Ta, Chuang, Shang-Ying, Chang, Hao-Yi, Tseng, Yung-Che, Shao, Kwang-Tsao, Muller, Marc

Journal:

Year:

2018

Language:

english

File:

PDF, 1.72 MB

english, 2018

19

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

Yi-Shao Lai,, Hsiao-Chuan Chang,, Ying-Ta Chiu,, Chang-Lin Yeh,, Jenn-Ming Song,

Year:

2007

Language:

english

File:

PDF, 953 KB

english, 2007

20

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Reliability and Failure Mechanism of Current-Stressed 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu Composite Flip-Chip Solder Joints with Cu or Au/Ni/Cu Substrate Pad Metallization

Chiu, Ying-Ta, Shao, Yu-Hsiu, Lai, Yi-Shao

Year:

2008

Language:

english

File:

PDF, 3.77 MB

english, 2008

21

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Song, Jenn-Ming, Shen, Yu-Lin, Su, Chien-Wei, Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

MATERIALS TRANSACTIONS

Year:

2009

Language:

english

File:

PDF, 178 KB

english, 2009

22

Strong Ion Regulatory Abilities Enable the Crab Xenograpsus testudinatus to Inhabit Highly Acidified Marine Vent Systems

Hu, Marian Y., Guh, Ying-Jey, Shao, Yi-Ta, Kuan, Pou-Long, Chen, Guan-Lin, Lee, Jay-Ron, Jeng, Ming-Shiou, Tseng, Yung-Che

Journal:

Frontiers in Physiology

Year:

2016

Language:

english

File:

PDF, 2.90 MB

english, 2016

23

Histological observations of ovotestis in the spotted scat Scatophagus argus

Yi-Ta SHAO, Li-Yue HWANG, Tsung-Han LEE

Journal:

Fisheries Science

Year:

2004

Language:

english

File:

PDF, 357 KB

english, 2004

24

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing

Lai, Yi-Shao, Chiu, Ying-Ta

Year:

2007

Language:

english

File:

PDF, 3.18 MB

english, 2007

25

Combination of adipose-derived mesenchymal stem cells (ADMSC) and ADMSC-derived exosomes for protecting kidney from acute ischemia–reperfusion injury

Lin, Kun-Chen, Yip, Hon-Kan, Shao, Pei-Lin, Wu, Shun-Cheng, Chen, Kuan-Hung, Chen, Yen-Ta, Yang, Chih-Chao, Sun, Cheuk-Kwan, Kao, Gour-Shenq, Chen, Sheng-Yi, Chai, Han-Tan, Chang, Chia-Lo, Chen, Chih-

Journal:

International Journal of Cardiology

Year:

2016

Language:

english

File:

PDF, 6.35 MB

english, 2016

26

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Size and substrate effects on microstructure and shear properties of solder joints

Gwo-Wei Lee,, Jenn-Ming Song,, Yi-Shao Lai,, Ying-Ta Chiu,, Chien-Wei Su,

Year:

2008

Language:

english

File:

PDF, 4.66 MB

english, 2008

27

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders

Song, Jenn-Ming, Lin, Li-Wei, Lee, Ning-Cheng, Lai, Yi-Shao, Chiu, Ying-Ta

Year:

2008

Language:

english

File:

PDF, 4.38 MB

english, 2008

28

Effects of dextromethorphan on MDMA-induced serotonergic aberration in the brains of non-human primates using [123I]-ADAM/SPECT

Ma, Kuo-Hsing, Liu, Tsung-Ta, Weng, Shao-Ju, Chen, Chien-Fu F., Huang, Yuahn-Sieh, Chueh, Sheau-Huei, Liao, Mei-Hsiu, Chang, Kang-Wei, Sung, Chi-Chang, Hsu, Te-Hung, Huang, Wen-Sheng, Cheng, Cheng-Yi

Journal:

Scientific Reports

Year:

2016

Language:

english

File:

PDF, 820 KB

english, 2016

29

Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Song, Jenn-Ming, Su, Chien-Wei, Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

Journal of Materials Research

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

30

Investigating the importance and cognitive satisfaction attributes of service quality in restaurant business - a case study of TASTy steakhouse in Taiwan

Wu, Tai-Hsi, Weng, Shao-Jen, Lin, Yi-Ta, Kim, Seung-Hwan, Gotcher, Don

Journal:

Journal of Foodservice Business Research

Year:

2020

File:

PDF, 2.32 MB

2020

31

A 0.18-$mu$ m CMOS RF Transceiver With Self-Detection and Calibration Functions for Bluetooth V2.1 ${+}$ EDR Applications

Wei-Yi Hu,, Jia-Wei Lin,, Kuo-Chi Tien,, Yong-Hsiang Hsieh,, Chao-Liang Chen,, Hung-Ta Tso,, Yi-Shun Shih,, Shao-Chueh Hu,, Sao-Jie Chen,

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2010

Language:

english

File:

PDF, 2.05 MB

english, 2010

32

Schistocephalus solidus infections increase gonadotropins and gonadotropin releasing hormone (GnRH3) mRNA levels in the three-spined stickleback, Gasterosteus aculeatus

Yi Ta Shao, Yung Che Tseng, Susanne Trombley, Pung Pung Hwang, Monika Schmitz, Bertil Borg

Journal:

Parasitology International

Year:

2012

Language:

english

File:

PDF, 254 KB

english, 2012

33

[IEEE 2013 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA) - Kaohsiung, Taiwan (2013.10.29-2013.11.1)] 2013 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference - Framework of ubiquitous healthcare system based on cloud computing for elderly living

Ou, Yang-Yen, Shih, Po-Yi, Chin, Yu-Hao, Kuan, Ta-Wen, Wang, Jhing-Fa, Shih, Shao-Hsien

Year:

2013

Language:

english

File:

PDF, 548 KB

english, 2013

34

PET Imaging of Serotonin Transporters With 4-[18F]-ADAM in a Parkinsonian Rat Model

Weng, Shao-Ju, Shiue, Chyng-Yann, Huang, Wen-Sheng, Cheng, Cheng-Yi, Huang, San-Yuan, Li, I-Hsun, Tao, Chih-Chieh, Chou, Ta-Kai, Liao, Mei-Hsiu, Chang, Yung-Ping, Ma, Kuo-Hsing

Journal:

Cell Transplantation

Year:

2013

Language:

english

File:

PDF, 558 KB

english, 2013

35

Acidified seawater suppresses insulin-like growth factor I mRNA expression and reduces growth rate of juvenile orange-spotted groupers, Epinephelus coioides (Hamilton, 1822)

Shao, Yi Ta, Chang, Feng Yu, Fu, Wen-Chun, Yan, Hong Young

Journal:

Aquaculture Research

Year:

2016

Language:

english

File:

PDF, 677 KB

english, 2016

36

Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects

Jenn-Ming Song, Bo-Ron Huang, Cheng-Yi Liu, Yi-Shao Lai, Ying-Ta Chiu, Tzu-Wen Huang

Journal:

Materials Science and Engineering: A

Year:

2012

Language:

english

File:

PDF, 1.32 MB

english, 2012

37

Surface Characterization of Argon/Methane Mixture Atmospheric-Pressure Plasma-Treated Filtration Poly(Vinylidene Fluoride) Membrane and Its Flux Enhancement

Juang, Ruey-Shin, Chen, Ko-Shao, Wei, Ta-Chin, Liu, Chi-Hung, Tsai, Ching-Yuan, Jheng, Hsu-Yi, Huang, Chun

Journal:

IEEE Transactions on Plasma Science

Year:

2014

Language:

english

File:

PDF, 1.51 MB

english, 2014

38

Multiple-copy-gene integration on chromosome ofEscherichia colifor beta-galactosidase production

Hsing-Ta Chen, Ming-Shu Lin, Shao-Yi Hou

Journal:

Korean Journal of Chemical Engineering

Year:

2008

Language:

english

File:

PDF, 419 KB

english, 2008

39

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

Yi-Shao Lai,, Ying-Ta Chiu,, Chiu-Wen Lee,, Yu-Hsiu Shao,, Jiunn Chen,

Year:

2008

Language:

english

File:

PDF, 3.19 MB

english, 2008

40

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Electromigration reliability of redistribution lines in wafer-level chip-scale packages

Lai, Yi-Shao, Kao, Chin-Li, Chiu, Ying-Ta, Appelt, Bernd K.

Year:

2011

Language:

english

File:

PDF, 1.35 MB

english, 2011

41

GnRH mRNA levels in male three-spined sticklebacks, Gasterosteus aculeatus, under different reproductive conditions

Shao, Yi Ta, Tseng, Yung Che, Chang, Chia-Hao, Yan, Hong Young, Hwang, Pung Pung, Borg, Bertil

Journal:

Comparative Biochemistry and Physiology Part A: Molecular & Integrative Physiology

Year:

2015

Language:

english

File:

PDF, 2.46 MB

english, 2015

42

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

Jenn-Ming Song,, Chien-Wei Su,, Yi-Shao Lai,, Ying-Ta Chiu,

Year:

2009

Language:

english

File:

PDF, 1.00 MB

english, 2009

43

A simplified, economical, and robust light trap for capturing benthic and pelagic zooplankton

Chan, Benny K.K., Shao, Kwang-Tsao, Shao, Yi-Ta, Chang, Yen-Wei

Journal:

Journal of Experimental Marine Biology and Ecology

Year:

2016

Language:

english

File:

PDF, 1.49 MB

english, 2016

44

Repair of Severe Tissue Loss and Deformity of Maxillofacial Area

How, Xin-kwang, Lui, Yon-yi, Luo, Shao-jun, He, Dong-cheng, Tan, Shao-ming, Yian, Ta-shin

Journal:

Annals of Plastic Surgery

Year:

1985

File:

PDF, 1.02 MB

1985

45

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Yi-Shao Lai, Ying-Ta Chiu, Jiunn Chen

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 639 KB

english, 2008

46

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - A study of self-assembled monolayer coating for non-stick encapsulation mold

Ya-Yu Hsieh,, Hung-Ta Hsu,, Lin, Martin T., Yi-Shao Lai,, Shu-Hui Chen,

Year:

2007

Language:

english

File:

PDF, 824 KB

english, 2007

47

Orientation transformation of Pb grains in 5Sn–95Pb/ 63Sn–37Pb composite flip-chip solder joints during electromigration test

Chiu, Ying-Ta, Lin, Kwang-Lung, Lai, Yi-Shao

Journal:

Journal of Materials Research

Year:

2008

Language:

english

File:

PDF, 930 KB

english, 2008

48

Supersaturation induced by current stressing

Ying-Ta Chiu, Chia-Hao Liu, Kwang-Lung Lin, Yi-Shao Lai

Journal:

Scripta Materialia

Year:

2011

Language:

english

File:

PDF, 343 KB

english, 2011

49

The complete mitochondrial genome of Hainanese barbel steed Hemibarbus medius Yue (Teleostei: Cyprinidae)

Chen, I-Shiung, Liao, Chiao-Ru, Shao, Yi-Ta

Journal:

Mitochondrial DNA

Year:

2014

Language:

english

File:

PDF, 118 KB

english, 2014

50

High-throughput identification of compounds targeting influenza RNA-dependent RNA polymerase activity

Ching-Yao Su, Ting-Jen R. Cheng, Meng-I. Lin, Shi-Yun Wang, Wen-I. Huang, Shao-Ying Lin-Chu, Yu-Hou Chen, Chung-Yi Wu, Michael M. C. Lai, Wei-Chieh Cheng, Ying-Ta Wu, Ming-Daw Tsai, Yih-Shyun E. Cheng

Journal:

Proceedings of the National Academy of Sciences

Year:

2010

Language:

english

File:

PDF, 1.24 MB

english, 2010

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